Semiconductor technology is constantly shrinking in size while growing in capability and functional integration. In order to enable next generation silicon technologies, semiconductor packages have also evolved to provide improved performance and flexibility.

For many years, Actel has been at the forefront of innovative packaging technology, providing more than just efficient interconnections between the integrated circuit (IC) and the board. Actel consistently delivers packages that provide the necessary mechanical and environmental protection to ensure consistent reliability and performance.

Actel IC packaging technology efficiently supports high density FPGAs with large pin count Ball Grid Arrays (BGAs), but is also flexible enough to accommodate stringent form factor requirements for Chip Scale Packaging (CSP). In addition, Actel offers a variety of packages designed to meet your most demanding application and economic requirements for today's embedded and mobile systems.

Actel's Packaging Technology Solution contains helpful information such as technical package details, discussions on the latest environmental issues, related industry articles and links, and implementation tools to assist you with your next design.

The use of lead and other harmful compounds in commercial and consumer electronic devices is a growing environmental problem. As political pressure over health issues have come to bear, the electronics industry has enacted sweeping initiatives to reduce lead in its products. There are many challenges associated with this transition, and Actel has dedicated some of its most experienced resources to develop lead-free solutions.

Actel's Packaging Technology Solutions provides the latest information about Actel Lead-Free and Green packaging technologies, as well as relevant industry links for implementation details, FAQs, and other technical information to help customers through this transition.

Actel offers a wide range of prototyping solutions to enable rapid design iterations and shorten your time-to-market. Designers can choose from a series of surface-mount sockets and standardized Extender adapter boards for both Actel's antifuse and flash FPGAs. Learn more about prototyping solutions from Actel and get simple step-by-step instructions to walk you through the assembly flow for attaching QFP and BGA sockets to your PCB.

All sockets and standard adapter boards are available for order from Actel. For more information contact your local Actel FAE or authorized manufacturers representative.