Low Power
Built on a low-power, high performance flash process, Fusion provides industry-leading low static and dynamic power. Fusion also offers several sleep and standby modes of operation to further extend battery life in portable applications. The Fusion RTC offers a wide variety of functionality: sleep, standby, periodic wake-up, and low-speed/-power operation. The addition of both a 1% RC oscillator and two-pin crystal oscillator circuit eliminates the need for expensive external clock sources.
Fusion allows customers to integrate several functions into a single-chip solution with
lower overall system power. In addition to an overall reduction in chip count, the
integration of several functions within Fusion prevents the introduction of lower
accuracy and noise that comes with a multi-chip solution. All the above factors add up
to a lower power profile that lends itself to other benefits, such as higher signal integrity
and lower overall system cost.
One Chip is All You Need
Until now, system designers were forced to choose costly and space-consuming
discrete analog components with programmable logic or mixed signal ASIC
solutions to implement a typical system. Fixed architectures and other
technology barriers prevented the integration of individual components into
a single, low-cost chip that met all design requirements.
Accuracy Better Than 1 Percent
Calibration eliminates certain errors common to ADCs, such as offset and gain errors.
If these errors are not adjusted, the measurements would be inaccurate and could impact
the overall system performance. External components can be used to eliminate the offset
and gain errors. However, this will add extra design complexity, noise and additional
inaccuracy that in turn must be eliminated. An ideal solution would be an integrated
device that provides the high accuracy without penalty. Fusion offers several
features such as the analog quad, embedded flash, and flash programmable logic, which can be
used with a software calibration scheme to provide a highly integrated solution with
better than one percent accuracy.
Live at Power-Up
Microsemi's programmable logic devices, based on nonvolatile memory technologies, store
their configuration in the logic gates, making the devices available to perform critical
system setup tasks such as system configuration and supervision during voltage ramp-up.
Additionally, rapid operation from ultra-low-power (typically less than 25 µW even for 3,000,000 system gates) sleep mode is possible.
Real-World Interface
Fusion offers up to 30 high-voltage-tolerant analog inputs, which enable direct connection to signals from –10.5 V to +12 V, eliminating the need for signal preconditioning. The Fusion analog-to-digital converter (ADC) is configurable and supports resolutions up to 12 bits, and sample rates up to 600,000 samples per second (ksps) in 8-bit mode. The overall ADC accuracy that can be achieved with the calibration solution is better than one percent. Fusion adds additional functionality with the inclusion of multiple differential input current monitor blocks, each with a built-in amplifier, increasing sensitivity and efficiency. The Fusion integrated temperature monitor circuitry allows for the monitoring of multiple remote temperatures with only an external diode. Up to ten high-current-drive outputs are ideal for metal oxide semiconductor field-effect transistor (MOSFET) control and/or pulse width modulation (PWM) functions such as direct fan control.
Dynamic System Configuration
The ability of Fusion devices to support many system-level functions in a single chip makes Fusion an ideal candidate for leading edge system management protocols. Fusion's high performance flash memory blocks provide nonvolatile memory flexibility to every aspect of your design. At system startup, the flash memory can be used to initialize the system. SRAMs and registers can be automatically loaded with data from the on-chip flash memory. Prior to system shutdown, the volatile values in SRAM or registers on the Fusion device can be saved back into the on-chip flash memory, preserving the state of the device for the next system startup (SAVE and RESTORE). Fusion flash memory also enables the dynamic changing of system parameters (CONTEXT switch). System boot codes can be stored in the flash memory for both on-chip and off-chip requirements. The flash memory can be configured to emulate EEPROM operation with an available endurance extender IP. The optional soft IP Common Flash Interface (CFI) core from Microsemi can use part of the flash memory for file storage.
Reconfiguring Systems
Inherent in the fabric of Fusion are the benefits of configurability and field reprogrammability, based on the successful ProASIC®3 family of flash FPGA devices. Fusion can be securely programmed late in the manufacturing process or after it is in the field. By enabling a single hardware platform to support multiple projects and products, Fusion allows designers to leverage economies of scale in purchasing, while maintaining the ability to customize products for different markets. Both the firmware (flash memory) and hardware can be updated in a single step.
Power and Thermal Management
Fusion is an exceptional solution for power management. Unlike today's multi-voltage FPGA solutions, Fusion devices can be driven
from a single 3.3 V supply, eliminating the need for special power-up sequencers.
Fusion can be configured to monitor and sequence a multi-voltage system for voltage and current. The unique combination of single-voltage operation and power management capabilities makes Fusion an excellent candidate for system/board management applications.
With Fusion, temperature control is built in. Fusion supports both on-chip (internal diode) and remote temperature monitoring capabilities. The Fusion device can flag the temperature and power at programmable thresholds to indicate a warning, turn on a fan, or shut down the system. Additionally, Fusion can use external temperature sensor inputs to control heating or cooling system elements.
The
Fusion Starter Kit and M1-enabled Fusion Starter Kit contain basic requirements for fully experimenting with Fusion's mixed signal FPGA capabilities. Starter kits include all I/Os connected to headers that can be connected to an external system and isolated from other components on the board.
The Fusion Embedded Development Kit and Fusion Advanced Development Kit are designed specifically for the development of embedded applications, including support for ARM Cortex-M1, Core8051s, and other soft IP processors.
The FlashPro3 programmer is targeted at the latest generation of flash devices to be offered by Microsemi: Fusion and M1 Fusion devices. FlashPro3 supports a robust programming solution for the Fusion device.
Designs programmed into Fusion and M1 Fusion devices can be debugged using logical analyzer software, working through the interface provided by the FlashPro3 programmer. The Identify® Microsemi Edition (AE) software also enables the control and exercise of the architecture-specific features of Fusion, such as the integrated ADC, the flash memory blocks, and the RTC, without the need to program a design into the FPGA core fabric itself.
