Actel Introduces Land Grid Array Packaging Option for Radiation-Tolerant RTAX-S FPGA Family
Low-Profile Package Provides Enhanced Performance and Flexibility
for Mission-Critical Military and Aerospace Designs
MOUNTAIN VIEW, Calif., July 07, 2005 —
Building on its commitment
to provide a comprehensive portfolio of high-reliability, high-performance
solutions for military and aerospace designers, Actel Corporation (NASDAQ:
ACTL) announced it has expanded its package selection to include a Land
Grid Array (LGA) option for its RTAX-S field-programmable gate array
(FPGA) family. With this package, military and aerospace customers have
the flexibility to use their proprietary or preferred-vendor technology
to attach columns or solder balls to the LGA package. Customers will
benefit from extended shelf-life, accelerated design time, reduced cost,
enhanced thermal and electrical performance, improved board-level reliability
and reduced solder joint stress. In combination with Actel's RTAX-S FPGAs,
the LGA package, is particularly well suited for mission-critical applications
in the military and aerospace industries.
"As the FPGA leader in the space and high-reliability markets,
Actel is committed to continuously enhancing its repertoire of robust
and reliable design solutions for the mil/aero community," said
Ken O'Neill, director, military and aerospace product marketing at Actel. "In
keeping with our heritage, the extension of the LGA packaging option
to Actel's radiation-tolerant RTAX-S family provides our customers with
more choices and allows us to better meet the requirements of military
and space applications where board space comes at a premium and reliability
is essential."
LGA Package Extends Product Shelf Life
Typically, column-attached products have a shelf life that is limited
by the solder column finish. With the availability of Actel's new LGA
package, customers can buy the LGA-packaged products and store them for
extended periods of time, attaching the columns or solder balls when
the part is actually needed for design implementation. This is especially
beneficial and cost efficient for military and aerospace customers who
work several years on a particular program.
Technical Details of Actel's LGA Package
The LGA package is a laminate substrate-based, fine-pitch chip-scale
package that provides a low package profile. The package body dimensions
are identical to the CCGA packages currently available. Reliable programming
is assured by using corresponding programming adaptor modules supported
by Actel's Silicon Sculptor II Programmer. The package is hermetically
sealed and complements the inherent radiation-tolerance benefits of the
RTAX-S architecture, including single-event latchup (SEL) immunity; single-event
upset (SEU) capability of >37MeV-cm2/mg; and total ionizing dose (TID)
performance of up to 200 Krads (Si, parametric).
Availability
The LGA package is now available for all RTAX-S devices offered in ceramic
column grid array (CCGA) packaging, including RTAX1000S and RTAX2000S
devices. For further information about Actel's advanced packaging solutions,
please visit the company's Web site at www.actel.com.
About Actel
Actel Corporation is a supplier
of innovative programmable logic solutions, including field-programmable
gate arrays (FPGAs) based on antifuse and flash technologies, high-performance
intellectual property (IP) cores, software development tools and design
services, targeted for the high-speed communications, application-specific
integrated circuit (ASIC) replacement and radiation-tolerant markets.
Founded in 1985, Actel employs more than 500 people worldwide. The
Company is traded on the Nasdaq National Market under the symbol ACTL
and is headquartered at 2061 Stierlin Court, Mountain View, CA, 94043-4655.
Telephone: 888-99-ACTEL (992-2835). Internet:: http://www.actel.com.
Contact: Stephanie Mrus, Actel Corporation, 650.318.4614
