Actel's Advanced Packaging Technology Delivers High-Density, Programmable Alternative to Known Good Die
Radiation-Tolerant for Space Applications, Small Form Factor Package
Can Be Wire-Bonded Within a Multi-Chip Module
MOUNTAIN VIEW, Calif., December 02, 2003 —
Actel Corporation (NASDAQ:
ACTL) today introduced an advanced packaging technology small enough
to enable the assembly of tested and programmed FPGAs into multi-chip
modules (MCMs) for space applications. Capable of delivering products
with a form factor similar to bare die, the new ceramic chip carrier
land grid (CCLG) package eliminates the handling, testing and programming
challenges associated with using known good die (KGD) in MCMs. Actel
also announced the availability of the first product based on this technology,
the RT54SX32S-CC256M, which is factory tested at both extremes of the
military temperature range and at room temperature prior to shipment.
With today's announcement, Actel demonstrates its commitment to the military
and aerospace market by delivering high-reliability, radiation-tolerant
products for MCM applications.
"Actel's designed-for-space antifuse FPGAs offer a highly reliable,
low-risk solution, which is especially important for mission-critical
applications,"
said Ken O'Neill, director, military and aerospace product marketing
at Actel.
"In the space industry, where board area is at a premium, die-size
solutions allow for the integration of different technologies in multi-chip
modules. With our tried-and-tested RTSX-S technology and the CC256 package,
Actel has overcome the dilemma of programming and testing at the die
level to offer a compelling alternative to KGD products."
Technical Details of Actel's CC256 Package
Custom designed by Actel for its 32,000-gate, radiation-tolerant, military
temperature grade RT54SX32S device, the 17mm x 17mm CCLG256 package is
78 percent smaller than its predecessor, the CQFP256. The underside of
the package is a 256-pad land grid array with 1.0mm pad spacing, which
enables reliable programming using programming modules supported by Actel's
Silicon Sculptor II Programmer. In operation, the underside of the package
is attached to the MCM substrate using an electrically non-conductive,
thermally conductive attach material. The topside of the package features
256 bonding fingers, to which bond wires are attached to complete the
electrical connections to other components within the MCM.
The package is hermetically sealed and employs the inherent radiation
tolerant benefits of the RTSX-S architecture, including single-event
latchup (SEL) immunity;
>37MeV-cm2/mg single-event upset (SEU) capability; and total ionizing
dose (TID) performance in excess of 100 Krads.
Availability
The CCLG256 package for RT54SX32S is available now. An application note,
titled
"Ceramic Chip Carrier Land Grid (CC256) Package Handling",
is available on Actel's Web site at http://www.actel.com/products/solutions/package/docs.aspx.
For further information regarding Actel's new advanced packaging solutions,
please visit the company's Web site at http://www.actel.com.
About Actel
Actel Corporation is a supplier
of innovative programmable logic solutions, including field-programmable
gate arrays (FPGAs) based on antifuse and flash technologies, high-performance
intellectual property (IP) cores, software development tools and design
services, targeted for the high-speed communications, application-specific
integrated circuit (ASIC) replacement and radiation-tolerant markets.
Founded in 1985, Actel employs approximately 500 people worldwide.
The Company is traded on the Nasdaq National Market under the symbol
ACTL and is headquartered at 955 East Arques Avenue, Sunnyvale, Calif.,
94086-4533. Telephone: 888-99-ACTEL (992-2835). Internet: http://www.actel.com.
Contact: Ferda Mehmet, A&R Edelman, 415.308.7877
